Job responsibilities:

• Define production, characterization and probe test plans for new products. Provide design for testability recommendations. Work closely with test and systems engineering to meet sample, characterization and production milestones.
• Complete characterization and product release requirements including: tester-to-bench correlation, test program repeatability analysis, device characterization over extreme operating conditions, establish production test guard-band limits. Hold a characterization yield meeting that highlights issues and test deviations between production test program and customer data sheet.
• Early engagement in engineering reviews in support of product development. Recommend reduced cost implementations (process, test, package etc.). Identify manufacturing issues associated with product introduction.
• Support package, process and device qualifications as required.
• Generate production test specifications and work closely with test facilities on new test program releases and optimization.
• Sustain and provide technical support to released products through yield, reliability, quality, and PCM monitoring with improvement and issue resolution activities as appropriate.
• Interface with outsource foundry, assembly, and test organizations as needed to support above activities.
• Resolve customer issues and RMAs through ATE and bench analysis. Lead ATE efforts to drive PPM reductions.

Skills and Experience:

• 5 years+ demonstrated success in product & test engineering developing, ramping, and sustaining ASICs in a fabless environment.
• Solid understanding of product/process interactions on leading edge CMOS technology nodes.SiGe BiCMOS experience a plus.
• RF and/or digital/ mixed signal product experience, combination highly desirable.
• BS; MS preferred.